1U
FG2 1100
FG2 1100 Series servers provide enhanced storage and CPU options based on specific application needs.
CoreTech / Rugged servers
FG2 3700
3U servers
Overview
About this platform.
Designed with up to four of the world’s highest-performing GPUs and either Intel® Xeon® Scalable or AMD EPYC™ processors with the latest PCIe Gen5 interconnectivity, the Crystal Group FG2 3700 Series servers deliver unmatched acceleration for data processing, machine learning, AI training, and AI inference. The scalable configuration can also accommodate ultra-fast DPUs. Pairing GPUs with DPUs enables enhanced data and application security, increased data center and cloud application performance, and ultra-low latency networking at the edge.
The compact, rugged design integrates high-capacity, long-life, custom power supplies, and custom heat sinks for optimal thermal performance. This ensures reliable, seamless execution of mission-critical applications—from real-time sensor fusion and object recognition to video processing and ray tracing—delivering complete, accurate, actionable intelligence.
This NVIDIA-Certified System is validated for optimal performance, manageability, security and scalability.
Technical detail
Know the platform.
FG2 3700 technical specifications
| Form Factor | 3U |
|---|---|
| Height | 5.25” (13.33 cm) |
| Depth | 19” (48.3 cm) or 22” (58.88 cm) |
| Width | 17.5” (44.45 cm) |
| Weight | 38–42 lbs (17.23–19.05 kg) or 40–62 lbs (18.14–28.12 kg) |
| Mounting | Glides, fixed mount (front and rear), or Jonathan rails |
| Power Supply | 800WAC, 1005W 18–36VDC, or 1200W AC 1+1 |
| CPU Architecture | 4th Generation Intel Xeon Scalable or AMD EPYC 9004 series processors; Up to 96 cores per socket (motherboard dependent) |
| Memory | 16GB–4TB DDR5 ECC SD RAM (motherboard dependent) |
| Expansion | Up to seven full-height PCIe slots |
| External Bays | Up to 24 SATA or SAS SSDs; Up to 12 U.2/U.3 NVMe SSDs |
| Software Compatibility | Windows 10, Windows 11, Windows Server, VMware, Linux |
| MIL-STD-810, Operational Temperature, high | Procedure II: +50°C, two-hour dwell, four cycles |
| MIL-STD-810, Operational Temperature, low | Procedure II: -30°C, two-hour dwell, four cycles |
| Electromagnetic Compatibility | MIL-STD-461 EMI/EMC, RE102, CE102; surface ship, below deck, and ground; RTCA/DO-160 Aircraft and airborne equipment, Category M |
Configuration affects weight and available options. Confirm your required configuration with CoreTech.
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