CoreTech / Embedded systems
RE1322
Rugged Embedded Computer
More GPU power in a small package.
Manufactured by 
Overview
About this platform.
Easily configurable to meet specific customer needs, the embedded product line boasts advanced thermal management and a carbon fiber chassis field-tested to withstand shock and vibration, extended temperature ranges, and harsh environments. The RE1322 has two expansion slots in the chassis, allowing for low-profile, double width cards like RTX A2000, and RTX 4000 SFF ADA.
Technical detail
Know the platform.
- Ultra lightweight, small form factor
- Intel® Core i7 CPU options
- DC power supply
- Up to 64GB unbuffered, non-ECC DDR4 1.2V SO-DIMM
- Two 15mm SSD or three 7mm SSD storage options, removable drives
- One PCIe slot for single or dual width cards
RE1322 technical specifications
| Height | 4.5" (11.43cm) |
|---|---|
| Width | 12" (30.48cm) |
| Depth | 9" (22.86cm); excluding connectors |
| Weight | 6.3-8.5 lbs. (2.9-3.86 kg) |
| CPU Architecture | 12th/13th Generation Intel® Core i7 CPU options |
| Expansion Slots | One PCIe slot for single or dual width cards |
| Internal Expansion Slots | Up to three SATA 2.5” SSD (externally removable) |
| Memory | Up to 64GB unbuffered, non ECC DDR4 1.2V SO-DIMM or 128GB ECC DDR4 with Xeon D |
| Power Supply | 18-36 VDC |
| Cooling | Three high reliability 60mm fans |
| Mounting | Tray or bulkhead mounted using ears supplied |
| MIL-STD-810, Operational Temperature | -40°C to +60°C |
| MIL-STD-810, Storage, Method 501, Procedure I/II | -40°C to +85°C |
| MIL-STD-810, Humidity, Method 507, Procedure II | 240 hours with humidity kit |
| MIL-STD-810, Altitude, Method 500 | 12,500ft operation, 40,000ft transport |
Configuration affects weight and available options. Confirm your required configuration with CoreTech.
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